DocumentCode
2485842
Title
Simulation and design of printed circuit boards utilizing novel embedded capacitance material
Author
Xuequan, Yu ; Hang, Yan ; Gezi, Zhang ; Haisan, Wang
Author_Institution
Huawei Technol. Co. Ltd., ShangHai, China
fYear
2010
fDate
25-30 July 2010
Firstpage
228
Lastpage
232
Abstract
The effects of a novel embedded capacitance material on PI-Power integrity, SI-Signal integrity and EMC-Electro Magnetic Compatibility were simulated and measured by comparing a multilayer board with embedded capacitance to a conventional multilayer board utilizing conventional FR-4 material. SIwave software was used to simulate electrical properties and EMC of the embedded capacitance material board and conventional FR-4 material board up to a frequency of 4 GHz. Finally, the application prospects of embedded capacitance materials are analysed.
Keywords
electromagnetic compatibility; electronic engineering computing; printed circuit design; EMC; PI-power integrity; SI-signal integrity; Slwave software; conventional FR-4 material; conventional multilayer board; electrical property; electromagnetic compatibility; embedded capacitance material; printed circuit board design; Capacitance; Capacitors; Clocks; Electromagnetic compatibility; Materials; Noise; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location
Fort Lauderdale, FL
ISSN
2158-110X
Print_ISBN
978-1-4244-6305-3
Type
conf
DOI
10.1109/ISEMC.2010.5711276
Filename
5711276
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