Title :
Hybrid method used to model via transitions
Author :
Wang, Hanfeng ; Ruehli, Albert E. ; Fan, Jun
Author_Institution :
UMR/MST EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Abstract :
A hybrid approach to solve via impedance and model via transitions is presented in the paper. The method is a combination of via-plane capacitance extraction and the impedance matrices calculation of parallel plane pair. A new formulation of the integral equation method for axially symmetric geometry is used for the capacitance extraction. The method is validated with other model results.
Keywords :
capacitance; geometry; impedance matrix; integral equations; printed circuit design; axially symmetric geometry; hybrid method; impedance matrices calculation; integral equation method; parallel plane pair; via impedance; via transitions; via-plane capacitance extraction; Capacitance; Conductors; Geometry; Impedance; Integrated circuit modeling; Mathematical model; Transmission line matrix methods; capacitance calculations; hybrid method; physics-based circuit model; power plane impedance;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location :
Fort Lauderdale, FL
Print_ISBN :
978-1-4244-6305-3
DOI :
10.1109/ISEMC.2010.5711308
