• DocumentCode
    2487060
  • Title

    DC blocking via structure optimization and measurement correlation for SerDes channels

  • Author

    Zhang, Jianmin ; Chen, Qinghua B. ; Fan, Jun ; Drewniak, James L. ; Orland, A. ; Archambeault, Bruce

  • Author_Institution
    CISCO Syst., Inc., San Jose, CA, USA
  • fYear
    2010
  • fDate
    25-30 July 2010
  • Firstpage
    557
  • Lastpage
    562
  • Abstract
    SerDes (Serializer/DeSerializer) is widely used in gigabit Ethernet systems, fiber-optic communication systems, and storage applications for high-speed data transmission between different ASICs (application-specific integrated circuit) with the significant advantage of saving package pin numbers. The channel connecting the Serializer/DeSerializer in two different ASICs on a PCB (Printed Circuit Board) is the SerDes channel defined in the paper. Since DC biases in different ASICs are usually different for their Serializer/DeSerializer circuits, DC blocking capacitors are then necessary to block the DC path for signal transmission through the SerDes channel. It is known that the trace impedance on a PCB can be well controlled in manufacturing while it is difficult for a DC blocking via structure. Therefore, the blocking via structure is the main discontinuity contributor of the SerDes channel. In this paper, two different DC blocking via structures are studied. The performances of the two structures are compared and correlated up to 20 GHz with full-wave modelling and measurements. This study reveals the advantages/disadvantages of the two via blocking structures. A via optimization tool, which is based on the cavity resonance algorithm to speed up the optimization, is used to obtain the optimized parameters for the two blocking via structures, and the following full-wave simulations give further performance explorations of the two via structures.
  • Keywords
    application specific integrated circuits; data communication; electromagnetic compatibility; local area networks; optical fibre communication; optimisation; printed circuits; ASIC; DC blocking; PCB; SerDes channels; application-specific integrated circuit; fiber-optic communication systems; gigabit Ethernet systems; high-speed data transmission; measurement correlation; package pin numbers; printed circuit board; serializer/deserializer channels; signal transmission; storage applications; structure optimization; Capacitors; Dielectric losses; Insertion loss; Optimization; Periodic structures; Scattering parameters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
  • Conference_Location
    Fort Lauderdale, FL
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4244-6305-3
  • Type

    conf

  • DOI
    10.1109/ISEMC.2010.5711337
  • Filename
    5711337