DocumentCode :
2487060
Title :
DC blocking via structure optimization and measurement correlation for SerDes channels
Author :
Zhang, Jianmin ; Chen, Qinghua B. ; Fan, Jun ; Drewniak, James L. ; Orland, A. ; Archambeault, Bruce
Author_Institution :
CISCO Syst., Inc., San Jose, CA, USA
fYear :
2010
fDate :
25-30 July 2010
Firstpage :
557
Lastpage :
562
Abstract :
SerDes (Serializer/DeSerializer) is widely used in gigabit Ethernet systems, fiber-optic communication systems, and storage applications for high-speed data transmission between different ASICs (application-specific integrated circuit) with the significant advantage of saving package pin numbers. The channel connecting the Serializer/DeSerializer in two different ASICs on a PCB (Printed Circuit Board) is the SerDes channel defined in the paper. Since DC biases in different ASICs are usually different for their Serializer/DeSerializer circuits, DC blocking capacitors are then necessary to block the DC path for signal transmission through the SerDes channel. It is known that the trace impedance on a PCB can be well controlled in manufacturing while it is difficult for a DC blocking via structure. Therefore, the blocking via structure is the main discontinuity contributor of the SerDes channel. In this paper, two different DC blocking via structures are studied. The performances of the two structures are compared and correlated up to 20 GHz with full-wave modelling and measurements. This study reveals the advantages/disadvantages of the two via blocking structures. A via optimization tool, which is based on the cavity resonance algorithm to speed up the optimization, is used to obtain the optimized parameters for the two blocking via structures, and the following full-wave simulations give further performance explorations of the two via structures.
Keywords :
application specific integrated circuits; data communication; electromagnetic compatibility; local area networks; optical fibre communication; optimisation; printed circuits; ASIC; DC blocking; PCB; SerDes channels; application-specific integrated circuit; fiber-optic communication systems; gigabit Ethernet systems; high-speed data transmission; measurement correlation; package pin numbers; printed circuit board; serializer/deserializer channels; signal transmission; storage applications; structure optimization; Capacitors; Dielectric losses; Insertion loss; Optimization; Periodic structures; Scattering parameters;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location :
Fort Lauderdale, FL
ISSN :
2158-110X
Print_ISBN :
978-1-4244-6305-3
Type :
conf
DOI :
10.1109/ISEMC.2010.5711337
Filename :
5711337
Link To Document :
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