DocumentCode
2487628
Title
Medical ultrasound transducers with SAC soldering technology: A new accelerated life model
Author
Catelani, Marcantonio ; Scarano, Valeria L.
Author_Institution
Dept. of Electron. & Telecommun., Univ. of Florence, Firenze, Italy
fYear
2011
fDate
30-31 May 2011
Firstpage
451
Lastpage
455
Abstract
Medical Equipment manufacturers are strongly interested in evaluation of the life of new soldering lead-free material used for the implementation of electronic parts. In fact, in the next few years, they will have to inform the Notified Body of RoHS conformity assessment of the medical instruments so produced. In particular, in the case of lead-free solders, the Notified Body will require evidence that such solders are equally reliable as tin-lead solders, for the proposed use and lifetime of the product. In order to support new International Standard on Medical Equipment and fill the technology knowledge gap, the paper presents a new accelerated life model able to evaluate the life of tin-silver-copper alloy under cycling climatic test. The use of new soldering material is taken into consideration in the design of ultrasound array transducer, which is the core of a linear phased array probe used for monitoring the cardiac muscle.
Keywords
biomedical transducers; biomedical ultrasonics; cardiology; copper alloys; muscle; silver alloys; solders; standards; tin alloys; ultrasonic transducer arrays; International Standard on Medical Equipment; RoHS directive; SAC soldering technology; SnAgCu; cardiac muscle monitoring; cycling climatic test; lead-free solders; linear phased array probe; medical devices directives; medical equipment manufacture standard; medical ultrasound transducer array; tin-silver-copper alloy; Lead; Life estimation; Materials; Reliability; Soldering; Transducers; accelerated life test; accelerating model for cycling climatic test; lead free; medical equipment; tin-silver-copper alloy; ultrasound piezoelectric transducer;
fLanguage
English
Publisher
ieee
Conference_Titel
Medical Measurements and Applications Proceedings (MeMeA), 2011 IEEE International Workshop on
Conference_Location
Bari
Print_ISBN
978-1-4244-9336-4
Type
conf
DOI
10.1109/MeMeA.2011.5966715
Filename
5966715
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