Title :
Single cell-mediated collagen reorganization in 3D matrices
Author :
Carey, Shawn P. ; Kraning-Rush, Casey M. ; Reinhart-King, Cynthia A.
Author_Institution :
Biomed. Eng., Cornell Univ., Ithaca, NY, USA
fDate :
Aug. 30 2011-Sept. 3 2011
Abstract :
Cells use cytoskeletally-generated force to adhere, migrate and remodel their environment. While cellular forces generated by cells plated on 2D substrates is well-studied, much less is known about the forces generated by cells in 3D matrices, which more closely mimic the in vivo environment. Here, an approach to characterize cellular forces in 3D using confocal reflectance microscopy is presented. Remodeling of collagen fibrils due to the forces exerted by embedded cells was imaged in real-time as cells adhere to and contract the matrix. We implemented this approach in conjunction with 2D Traction Force Microscopy to compare cytoskeletally-mediated forces of cells in 3D collagen matrices to forces exerted by cells on 2D collagen-coated hydrogel substrates. Our results indicate that confocal reflectance microscopy of collagen fibrils can provide semi-quantitative information regarding cellular force in 3D matrices, and that the actin cytoskeleton plays a similar role in regulating cell contractility in both 2D and 3D microenvironments.
Keywords :
biological techniques; biomechanics; cellular biophysics; molecular biophysics; optical microscopy; proteins; 2D microenvironments; 2D traction force microscopy; 3D matrices; 3D microenvironments; cell adherence; cell contractility; cell environment remodelling; cell migration; cellular forces; collagen fibril remodeling; confocal reflectance microscopy; cytoskeletally generated force; cytoskeletally mediated forces; single cell mediated collagen reorganization; Cancer; Force; Microscopy; Reflectivity; Substrates; Three dimensional displays; Transmission line matrix methods; Breast Neoplasms; Cell Line, Tumor; Collagen; Female; Humans;
Conference_Titel :
Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-4121-1
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2011.6091075