DocumentCode
2487858
Title
An ultra compact common-mode filter for RF Interference control in 3G wireless communication systems
Author
Lat-In Ao Leong ; Tsai, Chung-Hao ; Wu, Tzong-Lin
Author_Institution
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2010
fDate
25-30 July 2010
Firstpage
776
Lastpage
779
Abstract
A miniaturized common-mode suppression filter for GHz differential signals is realized using LTCC fabrication technology. The filter is realized in SMD-typed package with the physical size of 1.6 mm × 1.6 mm. Its equivalent circuit model is established to illustrate the properties of the common mode suppression and the differential mode propagation. It is found in measurement that the common-mode noise can be reduced over 10 dB from 1.8 GHz to 2.4 GHz in frequency domain, which covers the band of universal mobile telecommunication system (UMTS) in 3G wireless communication, and can be reduced about 30% in time domain under 1.4 Gbps PRBS. More importantly, the differential signal integrity, in terms of insertion loss and transmission phase in frequency domain and eye diagrams in time domain, is not degraded up to 5 GHz. To our best knowledge, it is the first SMD-type common-mode filter designed for gigahertz differential signals using LTCC technology.
Keywords
3G mobile communication; ceramic packaging; filtering theory; interference suppression; radiofrequency interference; 3G wireless communication systems; LTCC fabrication technology; LTCC technology; RF interference control; SMD-typed package; UMTS; gigahertz differential signals; miniaturized common-mode suppression filter; ultra compact common-mode filter; universal mobile telecommunication system; Frequency measurement; Insertion loss; Integrated circuit modeling; Loss measurement; Microwave filters; Noise; Time domain analysis; common-mode filter; differential signal; low temperature co-fired ceramic (LTCC); radio frequency interference (RFI); surface mounted device (SMD);
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location
Fort Lauderdale, FL
ISSN
2158-110X
Print_ISBN
978-1-4244-6305-3
Type
conf
DOI
10.1109/ISEMC.2010.5711377
Filename
5711377
Link To Document