Title :
Vibration analysis of an electronic enclosure using finite element analysis
Author :
Zampino, Marc A.
Author_Institution :
Lambda Novatronics Inc., Pompano Beach, FL, USA
Abstract :
Finite element analysis is used to predict the response of a rectangular box electronic enclosure and PWB to a random vibration load. Comparison of results is made for different modeling methodologies, including the effects of mesh size and mass distribution techniques
Keywords :
dynamic response; electronic engineering computing; finite element analysis; packaging; printed circuit design; vibrations; PWB; dynamic response; electronic enclosure; finite element analysis; mass distribution techniques; mesh size; modeling methodologies; random vibration load; rectangular box; robust environments; vibration analysis; Aluminum; Assembly; Electromagnetic interference; Filters; Finite element methods; Flanges; Frequency; Heat sinks; Wiring;
Conference_Titel :
Southcon/95. Conference Record
Conference_Location :
Fort Lauderdale, FL
Print_ISBN :
0-7803-2576-1
DOI :
10.1109/SOUTHC.1995.516125
