Physical properties of low temperature solders and die attach materials

Author

Gonzalez, Gerardo L. ; Liu, Yanqing ; Maganti, Srikanth S.

Author_Institution

Dept. of Mech. Eng., Florida Int. Univ., Miami, FL, USA

fYear

1995

fDate

7-9 Mar 1995

Firstpage

340

Lastpage

344

Abstract

The properties at the temperature range of -55°C to 180°C of several common solders used in electronic packaging are analyzed for mechanical properties (elastic modulus, yield point, ultimate tensile strength (UTS), and creep) and physical properties (microstructure and thermal expansion coefficient). Numerous experimental methods are utilized and correlated. The finite element method is used to model thermal stresses (thermal fatigue) induced by the mismatched coefficient of thermal expansion using all the results obtained in this work. Some preliminary data are presented together with previous data obtained in our laboratories for the Au-Sn eutectic alloy

Keywords

creep; elastic moduli; eutectic alloys; finite element analysis; gold alloys; microassembling; packaging; soldering; tensile strength; thermal analysis; thermal expansion; thermal stress cracking; tin alloys; yield point; -55 to 180 C; Au-Sn; Au-Sn eutectic alloy; DSC; creep; die attach materials; dynamic mechanical analyzer; elastic modulus; electronic packaging; finite element method; low temperature solders; mechanical properties; microstructure; mismatched thermal expansion coefficient; physical properties; thermal expansion coefficient; thermal fatigue; thermal stresses; ultimate tensile strength; yield point; Creep; Electronic packaging thermal management; Electronics packaging; Finite element methods; Mechanical factors; Microassembly; Microstructure; Temperature distribution; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Southcon/95. Conference Record

Conference_Location

Fort Lauderdale, FL

Print_ISBN

0-7803-2576-1

Type

conf

DOI

10.1109/SOUTHC.1995.516127

Filename

516127