DocumentCode :
2488234
Title :
Full-wave evaluation of carbon nanotubes as microwave interconnects
Author :
Kim, Kichul ; Rice, Paul ; Kabos, Pavel ; Filipovic, Dejan S.
Author_Institution :
Dept. of Electr., Comput., & Energy Eng., Univ. of Colorado, Boulder, CO, USA
fYear :
2010
fDate :
25-30 July 2010
Firstpage :
853
Lastpage :
856
Abstract :
Microwave interconnect configurations composed of single wall carbon nanotubes (CNTs) are studied in this paper. Specifically, an atomic layer deposition (ALD) enabled nano-coaxial line with individual CNTs comprising the inner conductor, CNT Goubau line with ALD enabled alumina coating, a nano-coaxial line with inner conductor composed of CNT bundles, and Goubau lines of CNT bundles are discussed. The characteristic impedance and losses of these interconnects are compared with the similar size copper-based transmission lines. Full wave simulations with incorporated quantum effects are conducted using finite element and method of moments tools ANSYS HFSS 1 and EMSS FEKO1, respectively. A thorough modeling validation, interconnect design and analysis are carried out over the wide microwave spectrum. Obtained results clearly show that although their inherent loss and impedance are high, the CNT interconnects can indeed outperform their copper counterparts with lower loss and impedance, and that observation is reinforced with decreasing the CNT radius.
Keywords :
alumina; carbon nanotubes; electric impedance; finite element analysis; interconnections; method of moments; microwave materials; nanotube devices; ALD enabled alumina coating; C; CNT Goubau line; atomic layer deposition; characteristic impedance; characteristic losses; finite element method; full-wave evaluation; method of moments; microwave interconnects; nanocoaxial line; single wall carbon nanotubes; Carbon nanotubes; Coatings; Conductors; Copper; Finite element methods; Impedance; Integrated circuit interconnections;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location :
Fort Lauderdale, FL
ISSN :
2158-110X
Print_ISBN :
978-1-4244-6305-3
Type :
conf
DOI :
10.1109/ISEMC.2010.5711391
Filename :
5711391
Link To Document :
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