• DocumentCode
    2489365
  • Title

    View context based 2D sketch-3D model alignment

  • Author

    Li, Bo ; Johan, Henry

  • Author_Institution
    Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2011
  • fDate
    5-7 Jan. 2011
  • Firstpage
    45
  • Lastpage
    50
  • Abstract
    2D sketch-3D model alignment is important for many applications such as sketch-based 3D model retrieval, sketch-based 3D modeling as well as model-based vision and recognition. In this paper, we propose a 2D sketch-3D model alignment algorithm using view context and shape context matching. A sketch consists of a set of curves. A 3D model is typically a 3D triangle mesh. It includes two main steps: precomputation and actual alignment. In the precomputation, we extract the view context features of a set of sample views for a 3D model to be aligned. To speed up the precomputation, two computationally efficient and rotation-invariant features, Zernike moments and Fourier descriptors are used to represent a view. In the actual alignment, we prune most sample views which are dissimilar to the sketch very quickly based on their view context similarities. Finally, to find an approximate pose, we only compare the sketch with a very small portion (e.g. 5% in our experiments) of the sample views based on shape context matching. Experiments on two types of datasets show that the algorithm can align 2D sketches with 3D models approximately.
  • Keywords
    Fourier analysis; mesh generation; solid modelling; 2D sketch-3D model alignment; 3D triangle mesh; Fourier descriptor; Zernike moments; model-based recognition; model-based vision; rotation-invariant feature; shape context matching; sketch-based 3D model retrieval; sketch-based 3D modeling; view context feature; view context matching; Computational modeling; Context; Context modeling; Feature extraction; Shape; Solid modeling; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Computer Vision (WACV), 2011 IEEE Workshop on
  • Conference_Location
    Kona, HI
  • ISSN
    1550-5790
  • Print_ISBN
    978-1-4244-9496-5
  • Type

    conf

  • DOI
    10.1109/WACV.2011.5711482
  • Filename
    5711482