DocumentCode :
2490228
Title :
Design of metal-grating-based surface plasmon interconnector between thin metal films
Author :
Choi, Dawoon ; Lee, Il-Min ; Lim, Yongjun ; Park, Junghyun ; Lee, Byoungho
Author_Institution :
Nat. Creative Res. Center for Active Plasmonics Applic. Syst., Seoul Nat. Univ., Seoul, South Korea
fYear :
2009
fDate :
26-28 Aug. 2009
Firstpage :
1
Lastpage :
4
Abstract :
Metal-grating-based interconnection schemes which interconnect two or three layers of thin metal film waveguides for the surface plasmon polaritons (SPPs) are investigated. In our proposed structure, SPPs propagating along a metal film are diffracted with a specific deviation angle when they pass through metal gratings. The diffracted light waves are converted into the SPP mode by properly arranged metal gratings on each metal film. Based on the well-established finite-element method (FEM), the design of proposed interconnector structures is evaluated and the performances are analyzed numerically. The efficiency of the directional interconnection is analyzed also.
Keywords :
diffraction gratings; dispersion relations; finite element analysis; integrated optics; metal-insulator boundaries; metallic thin films; optical dispersion; optical interconnections; optical waveguides; polaritons; surface plasmons; SPP mode; deviation angle; directional interconnection; dispersion relation; finite element method; insulator-metal-insulator symmetric structure; interconnector structures; metal grating; surface plasmon polaritons; thin metal film waveguides; Dielectrics; Diffraction gratings; Finite element methods; Integrated circuit interconnections; Magnetic fields; Optical propagation; Photonic integrated circuits; Plasmons; Semiconductor films; Surface waves; Surface plasmon polaritons; finite-element method; interconnector; metal film;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communications and Networking in China, 2009. ChinaCOM 2009. Fourth International Conference on
Conference_Location :
Xian
Print_ISBN :
978-1-4244-4337-6
Electronic_ISBN :
978-1-4244-4337-6
Type :
conf
DOI :
10.1109/CHINACOM.2009.5339838
Filename :
5339838
Link To Document :
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