• DocumentCode
    2490329
  • Title

    A LTCC-based Ku-band 3D bandpass filter using stepped-impedance hairpin resonators

  • Author

    Guo, Zequan ; Zhou, Jianming ; Zhou, Ju

  • Author_Institution
    Sch. of Inf. & Electron., Beijing Inst. of Technol., Beijing, China
  • Volume
    2
  • fYear
    2012
  • fDate
    5-8 May 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A new compact bandpass filter using stepped impedance (SI) hairpin resonators with multilayer configuration based on LTCC technology for Ku-band application is proposed. Two pairs of transmission zeros are achieved by introducing the cross coupling and asymmetric I/O structure, which can improve the rejection in the stop band. The compact filter is designed as a three-dimension structure which is embedded in the ceramic substrate based on the LTCC multilayer manufacturing technology. EM simulator HFSS is applied to design and optimize the proposed structure. The result shows a center frequency of 15.75 GHz with a bandwidth of 400 MHz. The insert loss is smaller than 2.1 dB, and the return loss is better than 18 dB within the passband. The overall dimension of the proposed filter is 4mm × 7.5mm × 1.056mm, about λg/2 × λg, which is suitable for the application in Ku-band integrated RF front end module.
  • Keywords
    band-pass filters; ceramic packaging; microwave filters; poles and zeros; EM simulator HFSS; Ku-band 3D bandpass filter; LTCC multilayer manufacturing technology; RF front end module; bandwidth 400 MHz; cross coupling; frequency 15.75 GHz; loss 2.1 dB; size 1.056 mm; size 4 mm; size 7.5 mm; stepped-impedance hairpin resonators; transmission zeros; Band pass filters; Couplings; Filtering theory; Microstrip filters; Microwave filters; Resonator filters; Substrates; Ku-band; LTCC; asymmetric I/O structure; bandpass filter; stepped impedance hairpin resonator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter Wave Technology (ICMMT), 2012 International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4673-2184-6
  • Type

    conf

  • DOI
    10.1109/ICMMT.2012.6230016
  • Filename
    6230016