Title :
A shielded microstrip-to-stripline vertical transition for multilayer printed circuit board
Author :
Huang, Qingchou ; Zhang, Shu ; Jiang, Wanshun
Author_Institution :
41st Inst. of China Electron. Technol. Group, Corp. Nat. Key Lab. of Sci. & Technol. on Electron. Test & Meas., Qingdao, China
Abstract :
This paper reports on a shielded vertical transition in multilayer PCBs. The design and analysis of microstrip-tostripline transition are presented, and back-to-back arrangements are considered. These interconnections are simulated and optimized by three-dimensional electromagnetic simulations, presents great performances from dc up to 40 GHz. A prototype is manufactured on RO4003c. Two band-pass filters in stripline technique are presented as the examples of application.
Keywords :
microstrip filters; microstrip transitions; multilayers; printed circuits; strip line transitions; 3D electromagnetic simulations; back-to-back arrangements; band-pass filters; multilayer printed circuit board; shielded microstrip-to-stripline vertical transition; Band pass filters; Integrated circuit interconnections; Metallization; Microwave circuits; Microwave filters; Nonhomogeneous media; Stripline; PCB; Vertical transition; band-pass filter; blind via; microstrip-tostripline;
Conference_Titel :
Microwave and Millimeter Wave Technology (ICMMT), 2012 International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-2184-6
DOI :
10.1109/ICMMT.2012.6230045
