• DocumentCode
    2491421
  • Title

    Active link mechanisms for physical man-machine interaction

  • Author

    Ochi, J. ; Hashimoto, T. ; Suzumori, K. ; Tanaka, J. ; Kanda, T.

  • Author_Institution
    Okayama Univ., Japan
  • Volume
    4
  • fYear
    2004
  • fDate
    28 Sept.-2 Oct. 2004
  • Firstpage
    3895
  • Abstract
    In this paper, we propose a new type of haptic interface, named active link mechanism. This device realizes physical man-machine interaction (PMI) between machines and persons. Two prototypes were developed to demonstrate the potential of the active link mechanisms. Developed interface devices are an active tetrahedron and an active icosahedron. Nine-DOF micro spherical joints and pressure control pneumatic cylinders were developed to realize the active tetrahedron, while fifteen-DOF micro spherical joints and intelligent pneumatic cylinders were developed for the active icosahedron. The tetrahedron successfully realizes "virtual touch"; the operators feel actions, forces, and shapes of the virtual objects in PC and also move and deform them. Real time PMI is realized by building the developed devices into MSC.Visual-Nastran4D. MSC.VisuaI-Nastran4D is a mechanism analysis software, which can make motion analysis in real time. The active icosahedron also realized dynamic interaction with virtual objects in PC, showing the potential of the devices as a haptic interface.
  • Keywords
    computer vision; haptic interfaces; man-machine systems; pneumatic actuators; pressure control; tactile sensors; virtual reality; active link mechanisms; haptic interface; mechanism analysis software; micro spherical joints; physical man-machine interaction; pressure control pneumatic cylinders; virtual touch; Actuators; Haptic interfaces; Machine intelligence; Man machine systems; Mechanical sensors; Mice; Microactuators; Pressure control; Prototypes; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Robots and Systems, 2004. (IROS 2004). Proceedings. 2004 IEEE/RSJ International Conference on
  • Print_ISBN
    0-7803-8463-6
  • Type

    conf

  • DOI
    10.1109/IROS.2004.1390022
  • Filename
    1390022