Title :
Mutual thermal effects of light-emitting diode with wafer-level packages
Author :
Choi, Jae-Wan ; Kang, Jeung-Mo ; Kim, Jae-Wook ; Choi, Jeong-Hyeon ; Kim, Du-Hyun ; Kim, Geun-Ho ; Lee, Jeong-Soo
Author_Institution :
LG Electron. Inst. of Technol., Seoul
Abstract :
Wafer-level packaged LEDs are useful for the high power applications such as back light unit (BLU) and general solid state lighting due to the compactness and integrated fabrication process with Si-MEMS technology. In this paper, thermal characteristics of wafer-level packaged LEDs with four multi-chips are investigated including mutual thermal effects due to the adjacent chips using both serial and parallel measurement methods.
Keywords :
light emitting diodes; optical fabrication; wafer level packaging; light-emitting diode; mutual thermal effects; solid state lighting; wafer-level packages; Costs; Electronic packaging thermal management; Etching; Geometrical optics; Light emitting diodes; Optical device fabrication; Semiconductor device measurement; Temperature; Thermal resistance; Wafer scale integration;
Conference_Titel :
Optical Fiber Communication and Optoelectronics Conference, 2007 Asia
Conference_Location :
Shanghai
Print_ISBN :
978-0-9789217-2-9
Electronic_ISBN :
978-0-9789217-2-9
DOI :
10.1109/AOE.2007.4410806
