Title :
CPW MMIC power amplifier design for flip-chip packaged power amplifiers
Author :
Wong, Alex ; McAdoo, Kyle ; Linton, David
Author_Institution :
Dept. of Electr. & Electron. Eng., Queen´´s Univ., Belfast, UK
Abstract :
There has been considerable interest in and development of MMIC power amplifiers for sub-miniature packaging using flip chip technology combined with CPW layout technologies. A new approach is developed to synthesis both the input/output power combining and impedance matching in a coplanar waveguide (CPW) MMIC power amplifier at 14 GHz. We then compare at selected band frequencies the output power gain and stability with those measured for a fabricated MMIC device of well known properties in order to validate the problem presented. Performance characteristics of this MMIC amplifier are compared with those of an identical simulated structure having an air bridged CPW realization
Keywords :
HEMT integrated circuits; MMIC power amplifiers; circuit stability; coplanar waveguides; field effect MMIC; flip-chip devices; impedance matching; integrated circuit design; integrated circuit metallisation; integrated circuit packaging; power combiners; 14 GHz; CPW MMIC power amplifier design; CPW layout technologies; PHEMT devices; SHF; coplanar waveguide; flip-chip packaged power amplifiers; impedance matching; input/output power combining; output power gain; performance characteristics; stability; sub-miniature packaging; Coplanar waveguides; Flip chip; Frequency; Impedance matching; MMICs; Packaging; Power amplifiers; Power generation; Power measurement; Stability;
Conference_Titel :
High Frequency Postgraduate Student Colloquium, 2000
Conference_Location :
Dublin
Print_ISBN :
0-7803-6590-9
DOI :
10.1109/HFPSC.2000.874078
