Title :
160??120 Uncooled IRFPA for Small JR Camera
Author :
Seto, Toshiki ; Kama, Keisuke ; Kimata, Masafumi ; Takeda, Munehisa ; Hata, Hisatoshi ; Nakaki, Yoshiyuki ; Inoue, Hiromoto ; Kosasayama, Yasuhiro ; Ohta, Yasuaki ; Fukumoto, Hiroshi
Author_Institution :
Mitsubishi Electr. Corp. Kamakura, Kamakura
Abstract :
We have developed a 160 times 120 SOI (silicon on insulator) diode uncooled IRFPA (Infrared Focal Plane Array) with 25 mum pixel pitch for a small IR camera. The IRFPA has a highly responsive pixel structure and is packaged in a chip scale vacuum package (CSVP) in order to reduce the package size. The size of the package is 14.5(L) times 13.5(W) times 1.2(H) mm. An infrared image of less than 60 mK in NETD (Noise Equivalent Temperature Difference) with f/1.0 optics has been obtained by the developed IRFPA.
Keywords :
cameras; chip scale packaging; focal planes; infrared imaging; semiconductor diodes; silicon-on-insulator; SOI diode; chip scale vacuum package; infrared focal plane array; infrared image; noise equivalent temperature difference; silicon on insulator diode; small IR camera; uncooled IRFPA; Cameras; Chip scale packaging; Diodes; Electromagnetic wave absorption; Infrared sensors; Leg; Sensor arrays; Silicon on insulator technology; Temperature sensors; Wafer scale integration;
Conference_Titel :
Sensors, 2006. 5th IEEE Conference on
Conference_Location :
Daegu
Print_ISBN :
1-4244-0375-8
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2007.355710
