Title :
The O-Sequence: Representation of 3D-Floorplan Dissected by Rectangular Walls
Author :
Ohta, Hidenori ; Yamada, Tomoaki ; Kodama, Chikaaki ; Fujiyoshi, Kunihiro
Author_Institution :
Dept. of Electron. & Inf. Eng., Tokyo Univ. of Agric. & Technol.
Abstract :
A 3D-floorplan of a rectangular solid is a dissection of the rectangular solid into smaller rectangular solids by planes, and can be used as a floorplan of a 3D VLSI. It is known that any 3D-floorplan restricted to a slicing structure can be coded by a slicing tree. However, no method of expressing any 3D-floorplan is known. In this paper, we propose an O-sequence, a string of representing any 3D-floorplan dissected by only non-crossing rectangular planes. We also present a necessary and sufficient condition for a given string to be an O-sequence
Keywords :
VLSI; integrated circuit layout; 3D VLSI; 3D-floorplan; O-sequence; noncrossing rectangular planes; rectangular solid; rectangular walls; slicing tree; Agricultural engineering; Agriculture; Informatics; Mathematics; Semiconductor device packaging; Simulated annealing; Solids; Sufficient conditions; Very large scale integration; Wiring;
Conference_Titel :
Research in Microelectronics and Electronics 2006, Ph. D.
Conference_Location :
Otranto
Print_ISBN :
1-4244-0157-7
DOI :
10.1109/RME.2006.1689960
