DocumentCode
2493436
Title
Codesign and Simulated Fault Injection of Safety-Critical Embedded Systems Using SystemC
Author
Perez, Jon ; Azkarate-Askasua, Mikel ; Perez, Antonio
Author_Institution
Embedded Syst. Group, IKERLAN-IK4 Technol. Res. Centre, Mondragon, Spain
fYear
2010
fDate
28-30 April 2010
Firstpage
221
Lastpage
229
Abstract
The international safety standard IEC-61508 highly recommends fault injection techniques in all steps of the development process of safety-critical embedded systems, in order to analyze the reaction of the system in a faulty environment and to validate the correct implementation of fault tolerance mechanisms. Simulated fault injection enables an early dependability assessment that reduces the risk of late discovery of safety related design pitfalls and enables the analysis of fault tolerance mechanisms at each design refinement step using techniques such as failure mode and effect analysis. This paper presents a SystemC based executable modeling approach for the codesign and early dependability assessment by means of simulated fault injection of safety-critical embedded systems, which reduces the gap between the abstractions at which the system is designed and assessed. The effectiveness of this approach is examined in a train on-board safety-critical odometry example, which combines fault tolerance and sensor-fusion.
Keywords
embedded systems; fault tolerant computing; safety-critical software; SystemC; fault injection codesign; fault tolerance mechanisms; faulty environment; international safety standard IEC-61508; onboard safety critical odometry; safety critical embedded systems; sensor fusion; simulated fault injection; Acceleration; Analytical models; Code standards; Embedded system; Failure analysis; Fault tolerant systems; Hardware; Risk analysis; Safety; Standards development; IEC-61508; SystemC; codesign; fault injection; odometry; safety;
fLanguage
English
Publisher
ieee
Conference_Titel
Dependable Computing Conference (EDCC), 2010 European
Conference_Location
Valencia
Print_ISBN
978-0-7695-4007-8
Electronic_ISBN
978-1-4244-6594-1
Type
conf
DOI
10.1109/EDCC.2010.34
Filename
5474177
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