DocumentCode
2494046
Title
[Front cover]
fYear
2009
fDate
7-9 Oct. 2009
Abstract
The following topics are dealt with: thermal modelling; integrated circuit modelling; 3D chip architectures; integrated circuit design; thermal measurement; advanced cooling techniques; and thermal interface materials.
Keywords
cooling; integrated circuit design; integrated circuit modelling; thermal analysis; 3D chip architectures; advanced cooling techniques; integrated circuit design; integrated circuit modelling; thermal interface materials; thermal measurement; thermal modelling;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
Conference_Location
Leuven
Print_ISBN
978-1-4244-5881-3
Type
conf
Filename
5340037
Link To Document