Abstract :
The following topics were dealt with: advanced packaging; thermal design; mechanical design; signal and power integrity; flip chip and interconnection; advanced material; embedded device; integrated passive device; and 3-D packaging.
Keywords :
VLSI; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; 3-D packaging; embedded device; flip chip technology; integrated passive device; interconnection; mechanical design; thermal design;
Conference_Titel :
VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-3498-5
DOI :
10.1109/VPWJ.2008.4762179
