Author :
Michitaka Kimura
Author_Institution :
Renesas Technology, Japan
Abstract :
Provides an abstract of the invited presentation and a brief professional biography of the presenter. The complete presentation was not made available for publication as part of the conference proceedings.
Conference_Titel :
VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-3498-5
DOI :
10.1109/VPWJ.2008.4762185
