Title :
Application for ball grid array package by using high heat resistant substrate (BN300)
Author :
Hagimura, A. ; Shima, K. ; Asahina, K. ; Sakuraba, H. ; Fujita, K. ; Tanaka, J.
Author_Institution :
Mitsui Toatsu Chem. Inc., Yokohama, Japan
Abstract :
High heat resistance substrate material, BN300, which MTC has developed utilizing MTC´s polymer alloy technology, shows good performance at high temperature and is able to be applied to the advanced package. In this paper, the high temperature performances and reliability of BN300 are presented. Also, a new packaging process using BN300 is proposed
Keywords :
composite materials; delamination; flip-chip devices; integrated circuit packaging; integrated circuit reliability; microassembling; thermal analysis; thermal expansion; BGA packaging process; BN300 substrate material; MTC; ball grid array package; epoxy resin; glass cloth; high heat resistant substrate; high temperature performance; polymer alloy technology; reliability; Chemical technology; Conductivity; Dielectric constant; Dielectric materials; Electronics packaging; Epoxy resins; Glass; Materials testing; Organic materials; Temperature;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3642-9
DOI :
10.1109/IEMT.1996.559684
