Application for ball grid array package by using high heat resistant substrate (BN300)

Author

Hagimura, A. ; Shima, K. ; Asahina, K. ; Sakuraba, H. ; Fujita, K. ; Tanaka, J.

Author_Institution

Mitsui Toatsu Chem. Inc., Yokohama, Japan

fYear

1996

fDate

14-16 Oct 1996

Firstpage

70

Lastpage

74

Abstract

High heat resistance substrate material, BN300, which MTC has developed utilizing MTC´s polymer alloy technology, shows good performance at high temperature and is able to be applied to the advanced package. In this paper, the high temperature performances and reliability of BN300 are presented. Also, a new packaging process using BN300 is proposed

Keywords

composite materials; delamination; flip-chip devices; integrated circuit packaging; integrated circuit reliability; microassembling; thermal analysis; thermal expansion; BGA packaging process; BN300 substrate material; MTC; ball grid array package; epoxy resin; glass cloth; high heat resistant substrate; high temperature performance; polymer alloy technology; reliability; Chemical technology; Conductivity; Dielectric constant; Dielectric materials; Electronics packaging; Epoxy resins; Glass; Materials testing; Organic materials; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3642-9

Type

conf

DOI

10.1109/IEMT.1996.559684

Filename

559684