A study on high-speed transmission characteristics of interconnections from PCB to chip

Author

Yamagishi, Keitro ; Ishibashi, Takuma ; Ohashi, Hideyuki ; Saito, Seiichi

Author_Institution

Mitsubishi Electr. Corp, Kamakura

fYear

2008

fDate

1-2 Dec. 2008

Firstpage

81

Lastpage

84

Abstract

In data transmission equipment for a broadband system, high-speed serial signal transmission has become essential technology. In order to transmit high-speed serial signals with low bit-error-rate, high accuracy in impedance matching of the transmission path is needed. In this paper, first we clarify the relation between the impedance deviations of each part in a signal transmission path and the return loss of this path by analyzing a simple equivalent circuit. Next, an optimization technique for the signal path between a PCB and a FC-BGA package is proposed. The simulation results show that the reflection loss is less than -13 dB and that the insertion loss is less than 2 dB ranging from DC to 16 GHz.

Keywords

equivalent circuits; error statistics; high-speed integrated circuits; impedance matching; integrated circuit interconnections; microprocessor chips; printed circuits; FC-BGA package; PCB; bit-error-rate; broadband system; chip; data transmission equipment; equivalent circuit; high-speed serial signal transmission; high-speed transmission characteristics; impedance matching; insertion loss; interconnections; reflection loss; return loss; signal transmission path; Circuit simulation; Data communication; Equivalent circuits; Impedance matching; Insertion loss; Integrated circuit interconnections; Packaging; Propagation losses; Reflection; Signal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th

Conference_Location

Kyoto

Print_ISBN

978-1-4244-3498-5

Type

conf

DOI

10.1109/VPWJ.2008.4762213

Filename

4762213