Title :
Mutual coupling between parallel half-mode substrate integrated waveguides
Author :
Lai, Q.H. ; Fumeaux, C. ; Hong, W.
Author_Institution :
East China Res. Inst. of Electron. Eng., Hefei, China
Abstract :
This paper presents an experimental study on the mutual coupling between pairs of parallel half-mode substrate integrated waveguides (HMSIWs) in three different configurations. The three different arrangements correspond to the cases where, firstly the open sides of the two HMSIWs face each other; secondly they share the linear array of metallic vias at their closed side; and thirdly the open side of one HMSIW faces the closed side of the second one. As a reference, the mutual coupling between pairs of parallel microstrip lines is also measured and compared to corresponding HMSIWs. The investigation shows that the best isolation can be achieved for the third configuration. The presented results and comparisons are of importance to the application of HMSIWs in the design of microwave integrated circuits (MICs) and array antenna feeds.
Keywords :
microstrip lines; substrate integrated waveguides; HMSIW; MIC; array antenna feeds; linear array; metallic vias; microwave integrated circuit design; mutual coupling; parallel half-mode substrate integrated waveguides; parallel microstrip lines; Couplings; Crosstalk; Frequency measurement; Microstrip; Microwave integrated circuits; Mutual coupling; Substrates;
Conference_Titel :
Microwave and Millimeter Wave Technology (ICMMT), 2012 International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-2184-6
DOI :
10.1109/ICMMT.2012.6230369