Title :
Highly reliable silicone TIM for CPU package - Silicone curable grease -
Author :
Miyoshi, Kei ; Yamada, Kunihiro ; Isobe, Kenichi
Author_Institution :
Shin-Etsu Chem. Co. Ltd., Tokyo
Abstract :
Power consumption of CPU was getting higher, and die size is larger during this decade. This trend affected what thermal interface material (TIM) should be chosen. For instance higher thermally conductive TIM grease was placed into CPU package in mid dasia90s. But this was not perfect solution. Because of pumping out issue happened with big packaging warpage with thermal cycle. Against this issue Cross-linking technology works very well. Especially low modulus (Gel phase) material shows the best performance for both thermal performance and reliability.
Keywords :
computers; gels; packaging; polymers; CPU package; cross-linking technology; die size; gel phase; packaging warpage; power consumption; silicone TIM; silicone curable grease; thermal cycle; thermal interface material; thermally condcutive TIM grease; Chemicals; Conducting materials; Energy consumption; Heat sinks; Materials reliability; Packaging; Polymers; Resistance heating; Thermal conductivity; Thermal resistance;
Conference_Titel :
VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-3498-5
DOI :
10.1109/VPWJ.2008.4762226
