Title :
Session 8 3-D packaging
Author :
Hiroshi Yamada ; Jan Vardaman, E.
Author_Institution :
Toshiba Corporation, Japan
Abstract :
Start of the above-titled section of the conference proceedings record.
Conference_Titel :
VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-3498-5
DOI :
10.1109/VPWJ.2008.4762234
