DocumentCode
2497022
Title
Thermographic investigation of osseous stress pathology
Author
Arthur, Daniel T J ; Khan, Masood Mehmood ; Barclay, Luke C.
Author_Institution
Dept. of Mech. Eng., Curtin Univ. of Technol., Perth, WA, USA
fYear
2011
fDate
Aug. 30 2011-Sept. 3 2011
Firstpage
6250
Lastpage
6253
Abstract
The debilitating pathology of stress fracture accounts for 10% of all athletic injuries[2], with prevalence as high as 20% in modern military basic training cohorts [3]. Increasing concerns surrounding adverse effects of radiology [5], combined with the 12.5% contribution of diagnostic imaging to Australian Medicare benefits paid in 2009-10 [6], have prompted the search for alternative/adjunct electronic decision support systems[7]. Within conducive physioanatomic milieu, thermal infrared imaging (TIRI) may feasibly be used to remotely detect and topographically map diagnostically useful signs of suprathreshold thermodynamic pathophysiology. This paper details a three month clinical pilot study into TIRI-based detection of osseous stress pathology in the lower legs of Australian Army basic trainees. A dataset of over 500 TIRI´s was amassed. The apparent `normal´ thermal profile of the anterior aspect of the asymptomatic lower leg is topographically defined and validated against current thermophysiological theory [8] via cadaveric dissection.
Keywords
biomedical optical imaging; bone; diseases; infrared imaging; debilitating pathology; electronic decision support systems; osseous stress pathology; stress fracture; suprathreshold thermodynamic pathophysiology; thermal infrared imaging; Educational institutions; Medical diagnostic imaging; Pathology; Stress; Temperature measurement; Training; Australia; Bone and Bones; Cadaver; Databases, Factual; Equipment Design; Fractures, Stress; Humans; Leg; Leg Injuries; Military Personnel; Spectrophotometry, Infrared; Temperature; Thermodynamics; Thermography; Tibia; Time Factors;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
Conference_Location
Boston, MA
ISSN
1557-170X
Print_ISBN
978-1-4244-4121-1
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2011.6091543
Filename
6091543
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