Investigations on bonding wire array for interconnect of RFICs

In this paper, analytical Moment Method (MoM) is used as one method for analyzing the equivalence between a flat solid rectangular plate and an array of bond wires. In addition, fuzzy Electromagnetism (EM) method is firstly used to derive the formulas of the inductance and capacitance of bonding wire array. To verify the validity and accuracy of proposed formulas for the bonding wire array, several structures with different numbers of bonding wires have been analyzed and simulated. Very good agreements can be found between the simulated S-parameters from the structures and that of the corresponding equivalent circuits. The proposed formulas can be used effectively in the design of practical bonding wire array in internal matching of transistors and IC packaging etc.