• DocumentCode
    2497141
  • Title

    High quality InGaAs/InP quantum wires fabricated by electron beam lithography

  • Author

    Notomi, Masaya ; Tamamura, Toshiaki

  • Author_Institution
    NTT Optoelectron. Labs., Atsugi, Kanagawa, Japan
  • fYear
    1993
  • fDate
    19-22 Apr 1993
  • Firstpage
    715
  • Lastpage
    718
  • Abstract
    The authors report the fabrication of high-quality quantum well wires (QWWs) by combining of electron-beam lithography, reverse-mesa wet etching, and metal organic vapor phase epitaxial overgrowth. They examined lateral size fluctuations of QWWs using atomic force microscopy. The results clearly show that size fluctuation is reduced by reverse-mesa etching. Furthermore, these QWWs show several clear quantum confinement effects for optical experiments which are the photoluminescence (PL) energy shift according to wire-size, the appearance of lateral quantized levels, and the change of optical anisotropy according to wire size in PL and electroluminescence
  • Keywords
    III-V semiconductors; atomic force microscopy; electroluminescence; electron beam lithography; etching; gallium arsenide; indium compounds; photoluminescence; semiconductor growth; semiconductor quantum wires; vapour phase epitaxial growth; InGaAs/InP quantum wires; atomic force microscopy; electroluminescence; electron beam lithography; energy shift; fabrication; lateral quantized levels; lateral size fluctuations; metal organic vapor phase epitaxial overgrowth; optical anisotropy; optical experiments; photoluminescence; quantum confinement effects; reverse-mesa wet etching; wire-size; Atom optics; Atomic force microscopy; Electron beams; Fabrication; Fluctuations; Geometrical optics; Indium gallium arsenide; Indium phosphide; Lithography; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1993. Conference Proceedings., Fifth International Conference on
  • Conference_Location
    Paris
  • Print_ISBN
    0-7803-0993-6
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1993.380544
  • Filename
    380544