Title : 
Improving Connectivity via Relays Deployment in Wireless Sensor Networks
         
        
            Author : 
Ibrahim, Ahmed S. ; Seddik, Karim G. ; Liu, K.J.R.
         
        
            Author_Institution : 
Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
         
        
        
        
        
        
            Abstract : 
Enhancing the connectivity of wireless sensor networks is necessary to avoid the occurrence of coverage gaps. In this paper, we aim at improving the network connectivity of a given network by adding a set of relays to it. We characterize the network connectivity by the Fiedler value, which is the second smallest eigenvalue of the Laplacian matrix representing the network graph. We propose a network-maintenance algorithm, which finds the best locations for a given set of relays. The proposed algorithm obtains the best relays´ locations through a multi-level approach. In each level, the search problem can be formulated as a standard semi-definite programming (SDP) optimization problem. We show that the proposed algorithm can increase the average Fiedler value by 35% by adding one relay only.
         
        
            Keywords : 
eigenvalues and eigenfunctions; graph theory; mathematical programming; matrix algebra; search problems; telecommunication network management; telecommunication network topology; wireless sensor networks; Fiedler value; Laplacian matrix; SDP optimization problem; coverage gap occurrence avoidance; eigenvalue; multilevel approach; network connectivity enhancement; network graph; network-maintenance algorithm; relay deployment; search problem; semidefinite programming; wireless sensor networks; Central Processing Unit; Eigenvalues and eigenfunctions; Iterative algorithms; Laplace equations; Quality of service; Relays; Sensor phenomena and characterization; Temperature sensors; Unmanned aerial vehicles; Wireless sensor networks;
         
        
        
        
            Conference_Titel : 
Global Telecommunications Conference, 2007. GLOBECOM '07. IEEE
         
        
            Conference_Location : 
Washington, DC
         
        
            Print_ISBN : 
978-1-4244-1042-2
         
        
        
            DOI : 
10.1109/GLOCOM.2007.223