• DocumentCode
    2497576
  • Title

    A Novel Method to Investigate Dependence of SAW Resonator Sensor Signatures on Localized Surface Perturbations

  • Author

    Lee, Sang Hun ; Massey, Eric W. ; Westafer, Ryan S. ; Hunt, William D.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    1203
  • Lastpage
    1206
  • Abstract
    We use a novel method to empirically investigate the dependence of SAW resonator signature on specific perturbation spots. We fabricated two-port SAW resonators and applied mass-loadings on several significant locations on the device surface using the BioChip ArrayerTM, a commercially available micro-dispenser for biomolecules. Frequency characteristics are measured for each SAW resonator sample with a different deposition location for the receptor molecules which represent an acoustic perturbation to the SAW resonator cavity. We could verify that the sensor signature is strongly dependent on the location of these perturbations as well as the concentration of the receptor molecules. We assert that the degree of impact is closely related to the non-uniform acoustic energy distribution on the SAW resonator surface. This study will give insight into how to strategically create the detection layer for the modern SAW resonator sensors by locating the areas where the sensing layer should or should not be deposited.
  • Keywords
    molecular biophysics; perturbation techniques; surface acoustic wave resonators; BioChip Arrayer; SAW resonator cavity; SAW resonator sensor signatures; biomolecules; localized surface perturbations; micro-dispenser; nonuniform acoustic energy distribution; perturbation spots; receptor molecules; Acoustic devices; Acoustic sensors; Acoustic signal detection; Acoustic waves; Biosensors; Frequency; Mechanical sensors; Sensor arrays; Sensor phenomena and characterization; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2006. 5th IEEE Conference on
  • Conference_Location
    Daegu
  • ISSN
    1930-0395
  • Print_ISBN
    1-4244-0375-8
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2007.355843
  • Filename
    4178838