Title :
A compact system-in-package integration of X band receiving module
Author :
Zhou, Jun ; Dou, Wen-Bin
Author_Institution :
State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China
Abstract :
A novel three dimensional system-in-package (SIP) transition in a standard multi-layer Low Temperature Co-fired Ceramic (LTCC) was proposed. Then this technology was applied to a kind of receiving module. The receiver module exhibits the total receiving gain of 35 dB, noise feature of 3 dB and very low RMS phase error of 3°. The design results in a small size (15.8 mm ×7.6 mm ×3.8 mm) and low weight (3 g).
Keywords :
MMIC; ceramic packaging; microwave receivers; system-in-package; X band receiving module; gain 35 dB; multilayer low temperature cofired ceramic; noise figure 3 dB; system-in-package; Gain; Microwave antennas; Microwave circuits; Microwave communication; Substrates; Transmission line measurements; Low-temperature co-fired ceramic; Receiver; System in package; Vertical transition;
Conference_Titel :
Microwave and Millimeter Wave Technology (ICMMT), 2012 International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-2184-6
DOI :
10.1109/ICMMT.2012.6230462
