DocumentCode
2498239
Title
Application of AHP to Evaluation on Failure Causes Analysis for Lithography Machine
Author
Ko, Po-Sheng ; Wu, Cheng-Chung ; Chen, Hsin-Hung ; Yang, Chung-Wen
Author_Institution
Dept. of Public Finance & Taxation, Nat. Kaohsiung Univeisity of Appl. Sci., Kaohsiung, Taiwan
fYear
2010
fDate
23-25 April 2010
Firstpage
571
Lastpage
573
Abstract
This study conducted hierarchical analysis on the evaluation item of the stability index of the lithography machine, and established a set of evaluation mechanism for failure prediction, in order to provide references and indicators of troubleshooting for lithography machine. The results showed, when the lithography machine is out of order, the possible failure causes are mainly be found based on the past experiences. This study also found that, under the good configuration of maintenance system, adequate information is closely associated a good system. As for lithography process in semiconductor industry, the complexity of broken Wafer is first considered. Thus, the overall lithography process of semiconductor relies on engineers´ experience. More specifically, a quick error interpretation and repair are required in field maintenance. As in a competitive market of semiconductor processing with high-tech and high-cost, a timely maintenance in the lithography machine is urgent and requested.
Keywords
failure analysis; lithography; maintenance engineering; production equipment; semiconductor industry; statistical analysis; AHP; failure causes analysis; hierarchical analysis; lithography machine; lithography process; maintenance system; repair; semiconductor industry; wafer complexity; Application software; Computer networks; Condition monitoring; Diagnostic expert systems; Etching; Failure analysis; Fault diagnosis; Lithography; Production; Public finance; Fuzzy Analytic Hierarchy Process; failure analysis; lithography machine;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer and Network Technology (ICCNT), 2010 Second International Conference on
Conference_Location
Bangkok
Print_ISBN
978-0-7695-4042-9
Electronic_ISBN
978-1-4244-6962-8
Type
conf
DOI
10.1109/ICCNT.2010.111
Filename
5474433
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