• DocumentCode
    2498341
  • Title

    Fabrication and Characterization of 2-DOF Micro Convective Accelerometer

  • Author

    Dao, Dzung V. ; Van Dau, T. ; Hayashida, M. ; Dinh, T.X. ; Shiozawa, T. ; Sugiyama, S.

  • Author_Institution
    Ritsumeikan Univ., Kyoto
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    1353
  • Lastpage
    1356
  • Abstract
    This paper presents the development of a dual axis convective microaccelerometer, whose working principle is based on the convective heat transfer and thermo-resistive effect of lightly-doped silicon. Different with developed convective accelerometer, the sensor utilizes novel structures of the sensing element which can reduce at least 93% of thermal-induced stress. By using numerical method, the chip dimensions and the package size are optimized. The sensitivity of the sensor was simulated; other characteristics such as frequency response, shock resistance, noise problem are also deeply investigated. The sensor has been fabricated by MEMS process and characterized by experiments.
  • Keywords
    accelerometers; convection; micromechanical devices; microsensors; 2-DOF micro convective accelerometer; MEMS process; convective heat transfer; dual axis convective microaccelerometer; frequency response; lightly-doped silicon; noise problem; sensor sensitivity; shock resistance; thermal-induced stress; thermo-resistive effect; Accelerometers; Fabrication; Frequency response; Heat transfer; Optimization methods; Packaging; Sensor phenomena and characterization; Silicon; Thermal sensors; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2006. 5th IEEE Conference on
  • Conference_Location
    Daegu
  • ISSN
    1930-0395
  • Print_ISBN
    1-4244-0375-8
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2007.355881
  • Filename
    4178876