High reliable FC-PBGA

Author

Ishida, Yoshihiro ; Katoh, Toshio ; Ishiwata, Syuuichi ; Omura, Atsushi ; Oohara, Tsutomu

Author_Institution

Citizen Watch Co. Ltd., Tokyo, Japan

fYear

1996

fDate

14-16 Oct 1996

Firstpage

104

Lastpage

108

Abstract

This paper is concerned with the high reliability of FC-PBGA (Flip Chip-Plastic Ball Grid Array). While flip chip technology is experienced in watch assembly and has a cost advantage, the chip sizes for watches are too small and not directly applicable to high reliable FC-PBGA. Considering the application of FC technology to FC-PBGA, the bump structure change for lower stress will be effective. For this change, three steps have been under examination: (1) application of FC assembly to peripheral bump structure, (2) establishment of re-distribution structure on chip, and (3) application of FC technology to area array bump structure. The result of the first step, application of FC assembly to peripheral bumping is reported in this paper. The bump structure has ensured a thermal fatigue resistance 3,000 cycles under the condition -40 C 30 min/125 C 30 min

Keywords

failure analysis; flip-chip devices; integrated circuit packaging; integrated circuit reliability; microassembling; plastic packaging; thermal stress cracking; -40 C; 125 C; 30 min; ball grid array; flip chip-plastic BGA; high reliability PBGA package; peripheral bump structure; stress; thermal fatigue resistance; Assembly; Bonding; Chemical technology; Costs; Electronics packaging; Flip chip; Stress; Thermal resistance; Watches; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3642-9

Type

conf

DOI

10.1109/IEMT.1996.559696

Filename

559696