Title :
Semi-insulating polyimide as a high resistive material
Author :
Iida, K. ; Mori, H. ; Nakamura, S. ; Sawa, G.
Author_Institution :
Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
Abstract :
A new polymer, designed by extending π electron systems along the molecular chain, has been studied from the view point of a high resistive or semi-insulating material. A high resistive polyimide thin film of 1012-1014 Ω cm without a large absorption current below 40 kV/cm has been obtained by the vapor deposition polymerization with pyromellitic dianhydride and 4,4´-diaminostilbene. It is also found that an increase in the orientation of molecular chain axis with decreasing thickness yields lower resistivity and that the orientation of pyromellitdiimide has little effect on the resistivity
Keywords :
electrical resistivity; insulating thin films; molecular orientation; polymer films; polymerisation; vapour deposited coatings; π-electron system; 4,4´-diaminostilbene; absorption current; molecular chain orientation; polyimide thin film; pyromellitic dianhydride; resistive material; resistivity; semi-insulating polymer; vapor deposition polymerization; Absorption; Conducting materials; Conductivity; Gold; Inorganic materials; Plastic insulation; Polyimides; Polymer films; Reflection; Voltage;
Conference_Titel :
Electrical Insulating Materials, 1998. Proceedings of 1998 International Symposium on
Conference_Location :
Toyohashi
Print_ISBN :
4-88686-050-8
DOI :
10.1109/ISEIM.1998.741712