DocumentCode
2498769
Title
Self-healing breakdown and electrical conduction of polyimide thin films
Author
Muramoto, Yuji ; Nagao, Masayuki ; Mizuno, Fumiaki ; Kosaki, Masamitsu
Author_Institution
Dept. of Electr. & Electron. Eng., Toyohashi Univ. of Technol., Japan
fYear
1998
fDate
27-30 Sep 1998
Firstpage
173
Lastpage
176
Abstract
We have been studying the breakdown characteristics of polyimide (PI) thin films by taking advantage of self-healing breakdown. The purpose of this study is to clarify the effect of ambient gas (SF6 , N2, Dry air) and thermal treatment on the self-healing breakdown characteristics of PI thin films in high temperature region. The electric strength (Fb) decreased with temperature and the Dc conduction current (I) increased with temperature. The Fb and I do not depend on ambient gas at high temperature. These results show a thermal breakdown process is considered as a possible breakdown mechanism of PI thin films in high temperature region
Keywords
electric breakdown; electric strength; electrical conductivity; heat treatment; insulating thin films; polymer films; DC conduction current; ambient gas; electric strength; electrical conduction; polyimide thin film; self-healing breakdown; temperature dependence; thermal breakdown; thermal treatment; Breakdown voltage; Electric breakdown; Electrodes; Polyimides; Polymer films; Semiconductor devices; Semiconductor thin films; Temperature dependence; Thin film devices; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials, 1998. Proceedings of 1998 International Symposium on
Conference_Location
Toyohashi
Print_ISBN
4-88686-050-8
Type
conf
DOI
10.1109/ISEIM.1998.741713
Filename
741713
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