Title :
Transport of electrons in the near-surface region of InP
Author :
Zou, Zhi-Xiang ; Lile, D.L.
Author_Institution :
Dept. of Electr. Eng., Colorado State Univ., Ft. Collins, CO, USA
Abstract :
Summary form only given. To study surface-related scattering mechanisms in InP the authors have fabricated and characterized enhancement mode metal-insulator-semiconductor FETs (MISFETs) on commercially available SI material as well as accumulation mode devices on n-type gas source molecular beam epitaxy grown epitaxial n-type material. In all cases the gate insulator was SiO2 deposited by low-pressure, indirect plasma enhanced chemical vapor deposition over the temperature range from ~175 to 275K. Experimental results obtained on both types of FET have included field effect and effective mobility values measured as a function of channel carrier density and temperature, over the range from ~77 to 300 K, and as a function of dielectric growth temperature. To elucidate the dominant scattering mechanisms in these devices, the surface transport was modeled by including, in addition to the standard bulk scattering processes, the effects of surface roughness, interfacial charge, and neutral surface impurity scattering. The results of surface mobility studies are presented, including the fitting of the experimental mobility data to the theory
Keywords :
III-V semiconductors; MISFET; carrier mobility; impurity scattering; indium compounds; surface conductivity; surface scattering; InP-SiO2; MISFET; accumulation mode; channel carrier density; dielectric growth temperature; effective mobility; enhancement mode; field effect; interfacial charge; neutral surface impurity scattering; semiconductor; surface roughness; surface transport; surface-related scattering mechanisms; Electrons; FETs; Indium phosphide; Inorganic materials; Plasma temperature; Rough surfaces; Scattering; Surface fitting; Surface roughness; Temperature distribution;
Conference_Titel :
Indium Phosphide and Related Materials, 1993. Conference Proceedings., Fifth International Conference on
Conference_Location :
Paris
Print_ISBN :
0-7803-0993-6
DOI :
10.1109/ICIPRM.1993.380630