Automatic classification of wafer defects: status and industry needs

Author

Shapiro, Arye

Author_Institution

SEMATECH, Austin, TX, USA

fYear

1996

fDate

14-16 Oct 1996

Firstpage

117

Lastpage

122

Abstract

This paper describes the Automatic Defect Classification (ADC) beta site evaluations performed as part of the SEMATECH ADC project. Two optical review microscopes equipped with ADC software were independently evaluated in manufacturing environments. Both microscopes were operated in bright-field mode with white light illumination. ADC performance was measured on three process levels of random logic devices: source/drain, polysilicon gate, and metal. ADC performance metrics included classification accuracy, repeatability, and speed. In particular, ADC software was tested using a protocol that included knowledge base tests, gauge studies, and small passive data collections

Keywords

automatic optical inspection; integrated circuit manufacture; optical microscopy; pattern classification; SEMATECH ADC project; automatic defect classification; beta site evaluations; bright-field mode; classification accuracy; classification speed; gauge studies; knowledge base tests; manufacturing environments; optical review microscopes; passive data collections; performance metrics; repeatability; semiconductor wafer defects; white light illumination; High speed optical techniques; Inspection; Lighting; Logic devices; Manufacturing; Measurement; Optical microscopy; Optical sensors; Scanning electron microscopy; Software testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3642-9

Type

conf

DOI

10.1109/IEMT.1996.559702

Filename

559702