Title : 
Application of surface passivation techniques and an in-situ hydrogen plasma for regrowth of InP by GSMBE
         
        
            Author : 
Hofstra, P.G. ; Thompson, D.A. ; Robinson, B.J. ; Hollinger, G. ; Streater, R.
         
        
            Author_Institution : 
McMaster Univ., Hamilton, Ont., Canada
         
        
        
        
        
        
            Abstract : 
To minimize defects at re-grown interfaces, in InP grown by gas source molecular beam epitaxy, surface passivation techniques were combined with an in-situ cleaning using a H-plasma. Surfaces were passivated by either a UV-ozone treatment or a monolayer of sulfur. Re-grown interfaces in Si-doped InP that had been UV-ozone and plasma cleaned contained virtually no electrically active defects (<5 × 1010 cm-2). Re-grown interfaces in Be-doped material that had been given the same treatment contained a defect concentration of 8 × 1011 cm-2. Secondary ion mass spectroscopy results material that was sulfur passivated and plasma cleaned contained an interfacial defect concentration of 8 × 1011 cm-2
         
        
            Keywords : 
III-V semiconductors; chemical beam epitaxial growth; indium compounds; passivation; secondary ion mass spectra; semiconductor growth; surface treatment; Be-doped material; GSMBE; H plasma; H-plasma; InP; InP:Be; InP:Si; S monolayer; SIMS; UV-ozone treatment; defects; electrically active defects; gas source molecular beam epitaxy; regrowth; surface passivation techniques; Hydrogen; Impurities; Indium phosphide; Passivation; Plasma applications; Plasma materials processing; Plasma measurements; Plasma sources; Plasma temperature; Surface treatment;
         
        
        
        
            Conference_Titel : 
Indium Phosphide and Related Materials, 1993. Conference Proceedings., Fifth International Conference on
         
        
            Conference_Location : 
Paris
         
        
            Print_ISBN : 
0-7803-0993-6
         
        
        
            DOI : 
10.1109/ICIPRM.1993.380701