Overall equipment effectiveness (OEE) and cost measurement [semiconductor manufacturing]

Author

Konopka, John ; Trybula, Walt

Author_Institution

SEMATECH, Austin, TX, USA

fYear

1996

fDate

14-16 Oct 1996

Firstpage

137

Lastpage

140

Abstract

Total Productive Maintenance (TPM) has provided a new perspective on semiconductor manufacturing. The need to improve performance requires more focus than ever on the TPM metric of Overall Equipment Effectiveness (OEE). Investigation of this data with a productivity analysis framework called the Capacity Utilization Bottleneck Efficiency System (CUBES) identifies and prioritizes productivity inefficiencies with their accompanying tool capacity decreases. A proposal for an extension of the CUBES to reflect cost measurement associated with these inefficiencies is discussed

Keywords

costing; economics; human resource management; integrated circuit manufacture; semiconductor device manufacture; CUBES; Capacity Utilization Bottleneck Efficiency System; cost measurement; overall equipment effectiveness; productivity analysis framework; semiconductor manufacturing; tool capacity reduction; total productive maintenance; Availability; Control systems; Costs; Electronics industry; Performance loss; Production; Productivity; Proposals; Semiconductor device manufacture; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3642-9

Type

conf

DOI

10.1109/IEMT.1996.559707

Filename

559707