DocumentCode
2501009
Title
A toolkit for developing multi-user, distributed virtual environments
Author
Codella, Christopher F. ; Jalili, Reza ; Koved, L. ; Lewis, J. Bryan
Author_Institution
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1993
fDate
18-22 Sep 1993
Firstpage
401
Lastpage
407
Abstract
The design and operation of the Virtual Reality Distributed Environment and Construction Kit (VR-DECK) toolkit developed at IBM Research is reviewed. It provides a designer with a development environment while supporting distributed computing, multi-user capability, and a variety of I/O devices. Virtual worlds are built as collections of modules which communicate via events. Extensive run-time support in the form of extensive C++ class libraries insulates the application designer from the low-level system details such as networking, inter-module data transport, event queuing and matching, and I/O device communication. A library of pre-defined modules is provided for commonly used functions and devices. An X Window System graphical user interface is provided for aggregating modules into applications. The system enables a developer to focus on the design of the application rather than on systems and integration issues
Keywords
development systems; distributed processing; graphical user interfaces; groupware; multi-access systems; programming environments; software libraries; software tools; virtual reality; C++ class libraries; I/O devices; VR-DECK; Virtual Reality Distributed Environment and Construction Kit; X Window System graphical user interface; commonly used functions; development environment; event matching; event queuing; inter-module data transport; module aggregation; multi-user, distributed virtual environments; networking; run-time support; software development toolkit; virtual worlds; Acoustic sensors; Buildings; Displays; Distributed processing; Graphics; Libraries; Sensor systems; Speech recognition; Virtual reality; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Virtual Reality Annual International Symposium, 1993., 1993 IEEE
Conference_Location
Seattle, WA
Print_ISBN
0-7803-1363-1
Type
conf
DOI
10.1109/VRAIS.1993.380752
Filename
380752
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