• DocumentCode
    2501542
  • Title

    The calculation of current on thin wires using a differential technique

  • Author

    Centeno, Anthony

  • Author_Institution
    Defence Evaluation & Res. Agency, Farnborough, UK
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    551
  • Abstract
    The calculation of induced current on wires is important if equipment immunity to electromagnetic hazards is to be assessed by numerical modelling. Differential techniques in the time domain are attractive for dealing with EMC calculations over a wide frequency range that involve complex geometries. This paper discusses the “in-cell” inductance and capacitance thin wire model currently used in the transmission line matrix (TLM) and finite difference time domain (FDTD) techniques. The performance of these models is assessed using some simple examples and comparison with method of moments calculations. It is concluded that care needs to be taken when using these models and the accuracy that can be obtained depends upon the proximity of the wires to conducting surfaces and other conductors
  • Keywords
    capacitance; differential equations; electric current; electromagnetic compatibility; electromagnetic induction; finite difference time-domain analysis; inductance; transmission line matrix methods; wires (electric); EMC calculations; FDTD; TLM; complex geometries; conducting surfaces; conductors; differential technique; dipole; electromagnetic hazards; equipment immunity; finite difference time domain; frequency range; in-cell capacitance thin wire model; in-cell inductance thin wire model; induced current; method of moments calculations; models performance; numerical modelling; time domain techniques; transmission line matrix; Electromagnetic compatibility; Electromagnetic modeling; Finite difference methods; Frequency; Geometry; Hazards; Inductance; Numerical models; Transmission line matrix methods; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2000. IEEE International Symposium on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-5677-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2000.874680
  • Filename
    874680