DocumentCode
2501725
Title
CMOS Microelectrode Array for Signal Recording and Stimulating of Neurons Assemble
Author
Pan, Hai-Xian ; Lü, Xiao-Ying ; Wang, Zhi-Gong
Author_Institution
State Key Lab. of Bioelectronics, Southeast Univ., Nanjing, China
fYear
2009
fDate
11-13 June 2009
Firstpage
1
Lastpage
4
Abstract
A microelectrode array (MEA) chip for in-vitro signal recording and stimulating of neurons assemble is presented. The chip comprises 4times4 active sensor cells and ESD protection circuits. Each sensor cell is 60 mumtimes60 mum in dimension, including a 15 mumtimes25 mum stimulating electrode, a 15 mumtimes25 mum recording electrode and two NMOS switches which can linearly transfer signals with peak-to-peak values from 50 muV to 500 mV. The final chip is realized in a standard 0.5 mum DPDM (double-poly double-metal) CMOS technology. It covers an area of 1.0 mmtimes1.0 mm. The results of on-wafer electrical test indicate the independent electrical characteristic of the stimulating electrode and the recording electrode and verify the functionality of the NMOS switches. The tests carried out in the NaCl solution for the packaged chip have verified the electrical functionality of the MEA chip.
Keywords
CMOS integrated circuits; bioelectric phenomena; biomedical electrodes; biomedical electronics; cellular biophysics; electrostatic discharge; microelectrodes; neurophysiology; sensor arrays; ESD protection circuit; NMOS switch; active sensor array cell; double-poly double-metal CMOS technology; microelectrode array chip; neuron assemble stimulation; on-wafer electrical test; recording electrode; signal recording; size 0.5 mum; size 1.0 mm; size 15 mum; size 25 mum; size 60 mum; stimulating electrode; voltage 50 muV; voltage 500 mV; Assembly; CMOS technology; Electrodes; Electrostatic discharge; In vitro; MOS devices; Microelectrodes; Neurons; Switches; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Bioinformatics and Biomedical Engineering , 2009. ICBBE 2009. 3rd International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2901-1
Electronic_ISBN
978-1-4244-2902-8
Type
conf
DOI
10.1109/ICBBE.2009.5162518
Filename
5162518
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