• DocumentCode
    2501945
  • Title

    Transient analysis of wave processes for multi-conductor transmission lines with branches using FDTD

  • Author

    Lu, Tiebing ; Cui, Xiang

  • Author_Institution
    North China Electr. Power Univ., Hebei, China
  • Volume
    2
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    699
  • Abstract
    Based on the multi-conductor transmission lines (MTLs), the three-phase 500 kV busbars and power lines in a 500 kV substation are modeled as the MTLs with branches in order to evaluate the electromagnetic fields radiated from the substation during the switching operation. The iterative formulae are presented to determine the boundary conditions at the node of the branches in this paper. The wave processes of voltage and current distributed along the busbars and the power lines without load in the substation are calculated with the finite-difference time-domain method (FDTD) when the circuit breakers and the disconnect switchers are closed. The numerical results are in agreement on ones calculated by Bergeron´s method
  • Keywords
    busbars; circuit breakers; current distribution; electromagnetic fields; electromagnetic interference; finite difference time-domain analysis; iterative methods; multiconductor transmission lines; power transmission lines; switching substations; transient analysis; 500 kV; Bergeron´s method; EMI; FDTD; boundary conditions; branches; circuit breakers; current distribution; disconnect switchers; finite-difference time-domain method; iterative formulas; multiconductor transmission lines; node; power lines; radiated electromagnetic fields; substation; switching operation; three-phase busbars; transient analysis; voltage distribution; wave processes; Boundary conditions; Electromagnetic fields; Electromagnetic modeling; Finite difference methods; Multiconductor transmission lines; Power transmission lines; Substations; Time domain analysis; Transient analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2000. IEEE International Symposium on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-5677-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2000.874706
  • Filename
    874706