DocumentCode
2502420
Title
A low-cost substrate transfer technology for fully integrated transceivers
Author
Dekker, R. ; van Deurzen, M.H.W.A. ; van der Einden, W.T.A. ; Maas, H.G.R. ; Wagemans, A.G.
Author_Institution
Philips Res. Lab., Eindhoven, Netherlands
fYear
1998
fDate
27-29 Sep 1998
Firstpage
132
Lastpage
135
Abstract
A low-cost post-processing technology to transfer on waferscale, circuits fabricated in any IC process, to an alternative substrate, e.g. glass, is presented. This technology combines the advantages of standard silicon IC processing with a complete freedom of substrate choice and enables the integration of high quality passive components and completely eliminates cross-talk between critical circuit parts
Keywords
UHF integrated circuits; glass; integrated circuit technology; substrates; transceivers; Si; crosstalk elimination; fully integrated transceivers; glass substrate; high quality passive components; low-cost substrate transfer technology; post-processing technology; standard Si IC processing; Bandwidth; Crosstalk; Dielectric substrates; Glass; Inductors; Integrated circuit technology; Isolation technology; Radio frequency; Silicon; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting, 1998. Proceedings of the 1998
Conference_Location
Minneapolis, MN
ISSN
1088-9299
Print_ISBN
0-7803-4497-9
Type
conf
DOI
10.1109/BIPOL.1998.741902
Filename
741902
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