Title :
A low-cost substrate transfer technology for fully integrated transceivers
Author :
Dekker, R. ; van Deurzen, M.H.W.A. ; van der Einden, W.T.A. ; Maas, H.G.R. ; Wagemans, A.G.
Author_Institution :
Philips Res. Lab., Eindhoven, Netherlands
Abstract :
A low-cost post-processing technology to transfer on waferscale, circuits fabricated in any IC process, to an alternative substrate, e.g. glass, is presented. This technology combines the advantages of standard silicon IC processing with a complete freedom of substrate choice and enables the integration of high quality passive components and completely eliminates cross-talk between critical circuit parts
Keywords :
UHF integrated circuits; glass; integrated circuit technology; substrates; transceivers; Si; crosstalk elimination; fully integrated transceivers; glass substrate; high quality passive components; low-cost substrate transfer technology; post-processing technology; standard Si IC processing; Bandwidth; Crosstalk; Dielectric substrates; Glass; Inductors; Integrated circuit technology; Isolation technology; Radio frequency; Silicon; Transceivers;
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 1998. Proceedings of the 1998
Conference_Location :
Minneapolis, MN
Print_ISBN :
0-7803-4497-9
DOI :
10.1109/BIPOL.1998.741902
