A zero X-Y shrinkage low temperature cofired ceramic substrate using Ag and AgPd conductors for flip-chip bonding

Author

Itagaki, Minehiro ; Bessho, Yoshihiro ; Eda, Kazuo ; Ishida, Tom

Author_Institution

Matsushita Electr. Ind. Co. Ltd., Osaka, Japan

fYear

1996

fDate

14-16 Oct 1996

Firstpage

156

Lastpage

161

Abstract

A zero X-Y shrinkage low temperature cofired ceramic (LTCC) substrate was developed, that was applied to the flip-chip bonded chip-size-packages (CSPs) and multi-chip modules (MCMs). The Ag internal conductor,the AgPd external conductor and the newly developed Ag via conductor could be used by matching the sintering shrinkage behavior with that of the zero X-Y shrinkage LTCC substrate. The flip-chip bonding using stud-bump-bonding (SBB) technique could be performed onto the external conductor of this developed substrate without Au plating and stable flip-chip bendability was obtained

Keywords

ceramics; flip-chip devices; integrated circuit packaging; microassembling; multichip modules; substrates; Ag; Ag internal conductors; Ag via conductor; AgPd; AgPd external conductors; LTCC substrate; MCM; chip-size-packages; flip-chip bonding; low temperature cofired ceramic substrate; multi-chip modules; sintering shrinkage behavior; stud-bump-bonding; zero X-Y shrinkage; Bonding; Ceramics; Conducting materials; Conductors; Glass; Gold; Temperature; Thermal conductivity; Thermal expansion; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3642-9

Type

conf

DOI

10.1109/IEMT.1996.559717

Filename

559717