Title :
On the parametric failures of SRAM in a 3D-die stack considering tier-to-tier supply cross-talk
Author :
Yueh, Wen ; Chatterjee, Subho ; Trivedi, Amit ; Mukhopadhyay, Saibal
Author_Institution :
Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper analyzes the supply crosstalk between logic cores and SRAMs on separate tiers in a 3D die-stack using a distributed RLC based 3D power grid model. The analysis shows that due to the supply cross-talk power variation in cores modulates the performances and parametric failures in SRAM.
Keywords :
SRAM chips; crosstalk; failure analysis; integrated circuit reliability; logic circuits; 3D power grid model; 3D-die stack; SRAM; crosstalk power variation; distributed RLC; logic cores; parametric failures; tier-to-tier supply crosstalk; Impedance; Noise; Pins; Power system stability; Random access memory; Stability analysis; Through-silicon vias; 3D integration; Power Delivery Network; parametric failure; static random access memory (SRAM);
Conference_Titel :
VLSI Test Symposium (VTS), 2012 IEEE 30th
Conference_Location :
Hyatt Maui, HI
Print_ISBN :
978-1-4673-1073-4
DOI :
10.1109/VTS.2012.6231064
