DocumentCode :
2502590
Title :
Imaging of sebaceous glands of human skin by three-dimensional ultrasound microscopy and its relation to elasticity
Author :
Kumagai, Kazutoshi ; Koike, Hideyuki ; Kudo, Yukina ; Nagaoka, Ryo ; Kubo, Kiyono ; Kobayashi, Kazuto ; Saijo, Yoshifumi
Author_Institution :
Grad. Sch. of Biomed. Eng., Tohoku Univ., Sendai, Japan
fYear :
2011
fDate :
Aug. 30 2011-Sept. 3 2011
Firstpage :
7199
Lastpage :
7202
Abstract :
High frequency ultrasound imaging has realized high resolution in vivo imaging of the biological tissues at a microscopic level. Human skin structure, especially sebaceous glands at the deep part of the dermis, was observed by three-dimensional ultrasound microscopy with the central frequency of 120 MHz. The visco-elasticity and surface sebum level of the observed region were measured by established testing devices. Both sebaceous glands density and surface sebum level were higher in cheek than those in forearm. The viscosity of forearm was lower than that of cheek. These results suggest that sebaceous glands may act as cushions of the skin besides their classical role of secreting sebum and some hormones. High frequency ultrasound imaging contributes to the evaluation of human skin aging.
Keywords :
biomechanics; biomedical ultrasonics; medical image processing; skin; viscoelasticity; 3D ultrasound microscopy; biological tissues; forearm; frequency 120 MHz; high frequency ultrasound imaging; hormones; human skin aging; human skin structure; sebaceous glands; surface sebum level; viscoelasticity; Acoustics; Humans; Microscopy; Sebaceous glands; Surface morphology; Ultrasonic imaging; Adult; Biomechanics; Dermis; Elasticity; Electric Conductivity; Electrophysiology; Equipment Design; Hair Follicle; Humans; Imaging, Three-Dimensional; Male; Sebaceous Glands; Sebum; Semiconductors; Skin; Skin Aging; Time Factors; Ultrasonics; Ultrasonography; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
Conference_Location :
Boston, MA
ISSN :
1557-170X
Print_ISBN :
978-1-4244-4121-1
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2011.6091819
Filename :
6091819
Link To Document :
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